Wafer Transfer Robot
Scara Blade 3-axis
Ceramic Bearing(for Hub, Arm, Pivot) for high temp. and vacuum
 
 

Specification

Equipment :
Process : CMP, CVD,ETCH
Wafer Size : 300mm only
Environment :
Repeatability Precision : within ±0.1mm
 
 

Repair Ass’y

CMP F1 Robot 3NS411
Producer F1 Robot 3N200mm Arm
CMP F1 Controller 3NS411
Producer F1 Controller 3NS410
 

Repair Knowhow

Blade Flatness Test
Wafer Transfer Test
Motion Range Confirmation
Input/output Signal Confirmation
Motion Repetition Test with Laser Sensor
Hand Unit Linier Test with Laser Microscope
 
Repair Process
 
 
 
 
 
 
 
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